
Manual revision 006 Appendix II: Electronics Disassembly/Reassembly SBE 19plus V2
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Appendix II:
Electronics Disassembly/Reassembly
Disassembly
1. As a precaution, upload any data in memory before beginning.
2. Remove the two Phillips-head screws holding the conductivity cell guard
to the housing. Do not remove the two screws holding the conductivity
cell guard to the sensor end cap.
3. Remove the Phillips-head screw holding the sensor end cap to
the housing on the side opposite the conductivity cell guard.
4. Remove the sensor end cap (with attached conductivity cell and
cell guard) and electronics:
A. Wipe the outside of the sensor end cap and housing dry, being careful
to remove any water at the seam between them.
B. Slide the end cap and attached electronics out of the housing.
C. The electronics are electrically connected to the battery compartment
bulkhead with a Molex connector. Disconnect the Molex connector.
D. Remove any water from the O-rings and mating surfaces inside the
housing with a lint-free cloth or tissue.
E. Be careful to protect the O-rings from damage or contamination.
Reassembly
1. Reinstall the sensor end cap, conductivity cell and guard, and electronics:
A. Remove any water from the O-rings and mating surfaces in the
housing with a lint-free cloth or tissue. Inspect the O-rings and
mating surfaces for dirt, nicks, and cuts. Clean or replace as
necessary. Apply a light coat of O-ring lubricant (Parker Super
O Lube) to the O-rings and mating surfaces.
B. Plug the Molex connector onto the pins on the battery compartment
bulkhead. Verify the connector holes and pins are properly aligned.
C. Carefully fit the end cap and electronics into the housing until the
O-rings are fully seated.
2. Reinstall the three screws to secure the end cap.
3. Reset the date and time (DateTime=) and initialize logging (InitLogging)
before redeploying. No other parameters should have been affected by the
electronics disassembly (send GetSD or DS to verify).
Before delivery, a desiccant package
is inserted in the electronics
chamber, and the chamber is filled
with dry Argon gas. These measures
help prevent condensation. If the
electronics are exposed to the
atmosphere, dry gas backfill with
Argon and replace the desiccant
package. See Application Note 71:
Desiccant Use and Regeneration
(drying) for desiccant information.
Battery replacement does not affect
desiccation of the electronics, as no
significant gas exchange is possible
unless the electronics PCBs are
actually removed from the housing.
Use caution during disassembly and
reassembly to avoid breaking the
conductivity cell.
Remove screw
(2 places)
attaching guard to
sensor end cap
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